Water accelerated self-healing of hydrophobic copolymers
نویسندگان
چکیده
منابع مشابه
Self-healing supramolecular block copolymers.
Polymer, heal thyself! Supramolecular ABA triblock copolymers formed by dimerization of 2-ureido-4-pyrimidinone (UPy) end-functionalized polystyrene-b-poly(n-butyl acrylate) (PS-b-PBA) AB diblock copolymers have been synthesized, resulting in a self-healing material that combines the advantageous mechanical properties of thermoplastic elastomers and the dynamic self-healing features of supramol...
متن کاملRandom hydrophilic-hydrophobic copolymers
We study a single statistical amphiphilic copolymer chain AB in a selective solvent (e.g. water). Two situations are considered. In the annealed case, hydrophilic (A) and hydrophobic (B) monomers are at local chemical equilibrium and both the fraction of A monomers and their location along the chain can vary, whereas in the quenched case (which is relevant to proteins), the chemical sequence al...
متن کاملPolystyrene/wood composites and hydrophobic wood coatings from water-based hydrophilic-hydrophobic block copolymers
D. J. Gardner Department of Forest Management and Advanced Engineered Wood Composites Center, University of Maine, Orono, ME 04469, USA Abstract The combination of synthetic thermoplastic polymers and wood is normally problematic because wood surfaces are hydrophilic while typical thermoplastic polymers are hydrophobic. A possible solution is to use block copolymer coupling agents. In this work...
متن کاملSelf-healing catalysis in water.
Principles for designing self-healing water-splitting catalysts are presented together with a formal kinetics model to account for the key chemical steps needed for self-healing. Self-healing may be realized if the catalysts are able to self-assemble at applied potentials less than that needed for catalyst turnover. Solution pH provides a convenient handle for controlling the potential of these...
متن کاملTowards Wearout-aware and Accelerated Self- healing Digital Systems
Background: Wearout (Aging) has been one of the most significant reliability concerns in CMOS circuit as the technology scaling continues and technology node advances [1]. It is a long term process that is caused by several interrelated physical mechanisms that conspire to worsen system metrics by slowing the circuit down and increasing the power. Even though emerging technologies, such as FinF...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Nature Communications
سال: 2020
ISSN: 2041-1723
DOI: 10.1038/s41467-020-19405-5